51309218-175 Low Level Analog Mux FTA | Honeywell
Specifications
Manufacturer: Honeywell
Product No.: 51309218-175
Condition: 10 Artículos en stock
Product Type: Analog Input Modules
Product Origin: USA
Payment:T/T, Western Union
Weight: 600g
Shipping port: Xiamen
Warranty: 12 months
Detalles de producto
Descripción
The Honeywell 51309218-175, also cataloged as the 51309218-175 Low Level Analog Mux FTA, operates as a dedicated hardware component for low-level analog signal multiplexing and signal conditioning within Honeywell MC-TAMR03 Rev. E/B systems.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | 51309218-175 |
| Brand | Honeywell |
| Origin | USA |
| Operating Temp | 0 to 60 deg C |
| Power Consumption | System-bus powered |
| Module Type | Low Level Analog Mux Field Termination Assembly |
| Switching Technology | Electromechanical Relay |
| System Compatibility | MC-TAMR03 Rev. E/B |
| Input Compatibility | RTD, Low-level Analog / Millivolt Signals |
Channel Isolation & Cold Junction Compensation
Designed for high-accuracy temperature acquisition circuits, this assembly integrates dedicated channel-to-channel isolation topology alongside cold junction compensation (CJC) reference paths. The physical signal processing path mitigates Common Mode Rejection Ratio (CMRR) degradation on millivolt-level RTD inputs, maintaining signal fidelity across all primary multiplexing node switches prior to A/D conversion on the backplane input processor.
Frequently Asked Questions
Q: What restricts the operational lifecycle of the electromechanical switching matrix on this board?
A: Channel switching frequency and physical contact wear degrade electromechanical relays over time; applications requiring continuous high-speed multiplexing are typically retrofitted to the solid-state 51305907-175 revision to eliminate mechanical failure points.
Q: How does cabinet vibration affect the operational integrity of the 51309218-175 board?
A: Mechanical vibration can induce contact bounce or intermittent open-circuits across the electromechanical relays, requiring installation within isolated enclosures compliant with standard industrial vibration thresholds.
Field Installation Guidelines
- Power down the target subsystem rack fully before seating or dismounting the termination board.
- Route field instrumentation wiring in dedicated signal trays away from high-voltage AC cables to reduce EMI coupling on low-level RTD circuits.
- Terminate all field cable shields at the designated chassis ground bus bar; do not double-ground shield wires.
- Verify physical engagement with the enclosure rails to guarantee mechanical stability against ambient vibration.
- Use standard grounded wrist straps and anti-static handling procedures during installation to prevent ESD damage to board-level componentry.
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