51201557-350 Input/Output Link Module | Honeywell

Specifications

  • Manufacturer: Honeywell

  • Product No.: 51201557-350

  • Condition: 10 Items in Stock

  • Product Type: Input/Output Link Modules

  • Product Origin: USA

  • Payment:T/T, Western Union

  • Weight: 100g

  • Shipping port: Xiamen

  • Warranty: 12 months

Product details

Description

The 51201557-350 is an Input/Output Link Module engineered for Honeywell Series C control systems. It facilitates high-speed, fault-tolerant communication between the C300 controller and associated Series 8 I/O modules, supporting dual I/O Link interfaces (Link A and Link B) for both standard and extended link configurations.

Communication Architecture and Redundancy

The module supports both non-redundant and redundant controller configurations through dual I/O Link interfaces. It is compatible with I/O Link Extender cards and fiber optic coupler modules, enabling long-distance I/O link extension across distributed industrial control architectures.

Physical Dimensions and Mounting

Featuring a modular design that integrates with Honeywell distributed control systems, the unit measures approximately 12.7 x 12 x 1.8 cm and weighs about 0.1 kg, facilitating compact mounting within control cabinets.

Technical Parameters

Parameter Specification
Model 51201557-350
Brand Honeywell
Product Type Input/Output Link Module
System Compatibility Honeywell C300, Series 8 I/O modules
Link Type Dual I/O Link interfaces (Link A and Link B)
Extension Support Compatible with I/O Link Extender cards and Fiber Optic Coupler modules
Dimensions Approx. 12.7 x 12 x 1.8 cm
Weight Approx. 0.1 kg
Manufacture Origin USA

Frequently Asked Questions

Q: Which control systems are compatible with the Honeywell 51201557-350 module?

A: It is designed for Honeywell Series C control systems, interfacing with C300 controllers and Series 8 I/O modules.

Q: Does this module support redundant controller configurations?

A: Yes, it supports both non-redundant and redundant controller configurations using dual Link A and Link B interfaces.

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