51307190-150 | Honeywell | EHPM I/O Link Board

Specifications

  • Manufacturer: Honeywell

  • Product No.: 51307190-150

  • Condition: 10 Items in Stock

  • Product Type: Communication Modules

  • Product Origin: USA

  • Payment:T/T, Western Union

  • Weight: 250g

  • Shipping port: Xiamen

  • Warranty: 12 months

Product details

Description

The 51307190-150 is an Enhanced High-Performance Process Manager (EHPM) I/O Link interface board designed for Honeywell TDC 3000 control systems. Functioning as a paddle card inserted into the EHPM chassis slot, it provides deterministic data exchange between the EHPM processor and Input/Output Processors (IOPs) across the Universal Control Network (UCN) architecture.

Communication and Buffer Architecture

The module utilizes an onboard SRAM buffering architecture paired with specialized driver/receiver interfaces to execute high-speed serial communications across the I/O link. This arrangement allows the EHPM to interface with multiple IOPs while preventing scan latency and maintaining deterministic control loops across LCN/UCN automation networks.

System Compliance and Installation

Operating on internal power supplied directly through the chassis backplane, the board functions within an operating temperature range of 0°C to +60°C and complies with FCC Part 15 Class A and CE standards. Proper field deployment requires inserting the paddle card into its designated slot with correct orientation, ensuring complete seat engagement with the backplane, and maintaining grounding standards for certified Zone 2 enclosure applications.

Parameter Specification
Model 51307190-150
Brand Honeywell
Module Type EHPM I/O Link Interface Board
Form Factor Paddle Card for EHPM Chassis Slot
Communication Interface I/O Link to IOPs via SRAM and Driver/Receiver
Operating Voltage Backplane Supplied
Operating Temperature 0 to +60 deg C
Compliance FCC Part 15 Class A, CE
Compatible Systems Honeywell TDC 3000 (LCN/UCN)
Weight 0.25 kg

Installation Notes

  1. Insert the paddle card into the designated EHPM slot, verifying proper physical orientation before seating.
  2. Ensure secure mechanical engagement with the I/O Link backplane interface connectors.
  3. Maintain system grounding and cable shielding compliance according to Honeywell standards.
  4. Verify operating ambient conditions remain within 0°C to +60°C.
  5. Deploy within certified industrial enclosures when installed in Zone 2 hazardous areas.

Frequently Asked Questions

Q: What function does the 51307190-150 perform in a TDC 3000 system?

A: It functions as an EHPM I/O Link interface module that handles deterministic communication and data buffering between the EHPM processor and downstream Input/Output Processors (IOPs).

Q: How is power supplied to this paddle card?

A: Operating voltage is drawn directly from the EHPM backplane slot, requiring no external power connections.

Q: What system architectures support this board?

A: The board is designed for Honeywell TDC 3000 systems operating within LCN/UCN control environments.

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